8486 30 30 — Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (B) to this chapter; parts and accessories: machines and apparatus for the manufacture of flat panel displays: apparatus for dry-etching patterns on liquid crystal device substrates

8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories: 8486 10 – Machines and apparatus for the manufacture of boules or wafers 8486 20 – Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits 8486 30 – Machines and apparatus for the manufacture of flat panel displays 8486 40 – Machines and apparatus specified in Note 9 (C) to this Chapter 8486 90 – Parts and accessories

This heading covers machines and apparatus used exclusively or mainly for the manufacture of semiconductor boules or plates, semiconductor devices, electronic integrated circuits or flat display panels. However, this heading does not cover machinery for measurement, control, inspection, chemical analysis, etc. (Chapter 90). (A) Machinery and apparatus for the production of semi-vehicle bullets or plates This category includes machinery and apparatus for the production of boules or plates, such as:

(1) Melting furnaces for zone melting and purification of silicon rods, furnaces for oxidising the surface of wafers, and diffusion furnaces for doping wafers with special impurities. (2) Crystal growing and pulling machines for producing monocrystalline semiconductor boules of very high purity, which can be sliced into wafers. (3) Crystal diffraction gratings which divide the crystal boules precisely to the diameter required for the wafers, and which divide the surface of the boules to indicate the conductivity type and resistivity of the crystal. (4) Wafer sawing machines, which slice wafers from boules of monocrystalline semiconductor material. (5) Wafer grinding, lapping and polishing machines, which prepare semiconductor wafers for the manufacturing process, including bringing the wafers to acceptable dimensions. Surface thickness is especially important. (6) Chemical mechanical polishing machines (CMP), which planarise and polish wafers by a combination of chemical removal and mechanical abrasion. (B) MACHINES AND APPARATUS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES OR OF ELECTRONIC INTEGRATED CIRCUITS This category covers apparatus for the manufacture of semiconductor devices or electronic integrated circuits, such as: (1) Film formation equipment, used to produce various films on the surface of wafers during processing. This film serves as a conductor, insulator and semiconductor in the finished device. It may contain sulphides and nitrides from the surface of the substrate, metals and epitaxial layers. The processes and equipment listed below are not necessarily limited to creating any particular type of film: (a) oxidation furnaces, which form a "film" of oxide on the wafer. The oxide forms as a result of a chemical reaction of the upper molecular layers of the wafer with technical oxygen or steam at high temperature; (b) chemical deposition equipment, which deposits films of various types obtained by combining the appropriate gases in a reaction chamber at high temperatures. This constitutes a thermochemical reaction with an evaporation phase. The operations are carried out at atmospheric or low pressure (LPCVD) and may involve plasma treatment (PECVD); (c) physical vapour deposition apparatus, which produces various kinds of film obtained by vaporising a solid substance. For example: (1) evaporation equipment, in which the film is produced by heating the source material; (2) sputtering equipment, in which the film is produced by bombarding the source material (target) with ions; (d) molecular beam epitaxy (MBE) equipment, designed for growing epitaxial layers on a heated monocrystalline substrate in

ultra-high vacuum using molecular beams. A process similar to PVD. (2) Doping equipment, designed for applying dopant to the surface of the wafer in order to change the conductivity or other characteristics of the semiconductor layer, such as: (a) thermal diffusion equipment, designed for applying dopants to the surface of the wafer by means of gases at high temperatures; (b) ion implantation equipment, in which dopants are "driven" into the crystal lattice of the wafer surface in the form of a beam of accelerated ions; (c) annealing furnaces, which restore the crystal lattice structure of the wafer damaged during ion implantation. (3) Etching and stripping equipment for etching or cleaning the surface of wafers, such as: (a) wet etching equipment, in which chemical etching materials are applied by spraying or immersion. Spray etchers give a more uniform result than etching tanks, since they process only one wafer at a time; (b) dry plasma etching equipment, in which the etching materials are presented as gases in a field of plasma energy which forms an anisotropic etch profile. Dry etching machines use several different methods of creating the gaseous plasma which removes the thin-film material from semiconductor wafers; (c) ion beam milling equipment, in which ionised gas atoms are directed at the surface of the wafer. The effect is that the top layer is physically removed from the surface; (d) strippers, or ashing machines: using a technology similar to etching, these apparatus remove used photoresist from the surface of the wafer after it has served its function as a "template". This equipment may also remove nitrides, oxides and polysilicon by means of an isotropic etch profile. (4) Lithography equipment, which transfers the circuit pattern onto the surface of a photoresist-coated semiconductor wafer, such as: (a) equipment for coating wafers with photoresist. This equipment includes photoresist spinners, which spread liquid photoresist evenly over the surface of the wafer; (b) equipment for applying the circuit pattern to the photoresist-coated wafer (or parts thereof): (i) using a mask or reticle and exposing the photoresist to light (generally ultraviolet) or, in some cases, to X-rays: (a) contact printers, in which the mask or reticle is in direct contact with the wafer during exposure;

(b) closely-masked devices that are similar to contact printing devices, except that there is no direct contact of the mask or template with the plate; (c) scanning devices that use projection technologies to expose the constantly-moving slit across the mask and plate; (d) step-by-step and remapping devices that use projection technology to expose the plate one section at a time. Exposure from the mask to the plate can be performed either with a decrease, or 1: 1. The processing includes the use of an excimer laser; (ii) equipment for direct drawing of the pattern on the plate. These devices work without a mask or pattern. They use computing machines that control a “writing beam” (such as an electron beam (E-beam, ion beam, or laser beam) to draw a pattern of the circuit directly onto a photoresist coated plate. (5) Equipment for processing exposed plates. This equipment includes chemical baths similar to those used in photo labs. This heading also includes: (i) centrifuges for coating an insulated substrate or plate with a photoresist material; (ii) screen printing for printing on the insulating substrate with printing ink resistant to etching; (iii) laser cutting machines for splitting plates into crystals; (iv) saws for cutting plates.

(C) Machines and apparatus for the production of flat display panels This category covers the manufacture of flat panels from substrates. However, it does not cover the production of glass or the installation of printed circuit boards or other electronic components on flat panels. This category includes machines and equipment for the production of flat display panels: (1) Equipment for engraving, developing, cutting or cleaning. (2) Apparatus for projecting, drawing or galvanostegy of a mask pattern. (3) Spindle centrifugal drying machines and other drying devices. (4) Machines (spinning machines) designed to cover photographic emulsions. (5) Installations of ion implantation for doping of materials. (6) Stoves, chambers and other equipment for dissipation, oxidation, annealing or rapid heating. (7) Apparatus for chemical and physical vapor deposition.

(8) Grinding and polishing machines. (9) Sawing, scribing or scoring machines. (D) MACHINES AND APPARATUS SPECIFIED IN NOTE 9 (C) TO THIS CHAPTER This category covers machines and apparatus of a kind used solely or principally for: (1) the manufacture or repair of masks and reticles (e.g., apparatus (photoplotters) for the photographic production of photomasks, and ion milling machines for the repair of masks and reticles); (2) assembling semiconductor devices or electronic integrated circuits, for example: (a) laser engraving machines for engraving on the plastic body of finished monolithic integrated circuits or discrete semiconductor components; (b) encapsulation equipment, such as presses, for producing plastic packages by moulding plastics around the chips; (c) wire bonders for bonding gold electronic wires to the contact areas of a monolithic integrated circuit by ultrasonic or electro-compression bonding; (d) bumping – a process of forming connectors on the whole wafer before the wafer is separated into chips; (3) lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits or flat panel displays (e.g., automated material handling machines for transporting, loading/unloading and storing semiconductor wafers, wafer cassettes and boxes, and other materials for semiconductor devices). (E) PARTS AND ACCESSORIES Subject to the general provisions regarding the classification of parts (see the General Explanatory Note to Section XVI), this heading covers parts and accessories of the machines and apparatus of this heading. Parts and accessories of this heading thus include, inter alia, tool holders or work holders and other special attachments which are used solely or principally with the apparatus of this heading.

Notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. This group does not include:

(a) millstones, grinding stones or other articles of Chapter 68;

(b) equipment or devices (e.g. pumps) of ceramic materials and ceramic parts of machinery or devices of any material (Chapter 69);

(c) laboratory glassware (heading 7017); equipment, devices or other articles for technical purposes or parts thereof of glass (heading 7019 or 7020);

(d) articles of heading 7321 or 7322 or similar articles of other base metals (Chapters 74 to 76 or 78 to 81);

(e) vacuum cleaners of heading 8508;

(f) electromechanical household appliances of heading 8509; digital cameras of heading 8525;

(g) radiators for articles of Section XVII; or

(h) manual mechanical brushes for floor cleaning, without engine (heading 9603).

2. Subject to the provisions of Note 3 to Section XVI and Note 11 to this Chapter, a machine or device which meets the description in one or more of headings 8401 to 8424 or heading 8486 and at the same time the description in one or more headings 8425 to 8480 is included in the relevant heading of the first series of headings or in heading 8486 as the case may be, and not in the second series.

(A) However, heading 8419 does not cover:

(i) seed germination equipment, incubators or brooders (heading 8436);

(ii) machinery for wetting grains (heading 8437);

(iii) diffusion apparatus for the extraction of sugary juice (heading 8438);

(iv) equipment for the heat treatment of textile yarn, textile materials or finished textile articles (heading 8451); or

machining equipment, assemblies or laboratory equipment in which temperature change, even if necessary, is an auxiliary process.

(B) Heading 8422 does not cover:

(i) sewing machines for sewing bags or similar packagings (heading 8452); or

(ii) office equipment of heading 8472.

(C) Heading 8424 does not cover:

(i) paint-blasting printing presses (heading 8443); or

(ii) water jet cutting machines (heading 8456).

3. A machine for processing any material which corresponds to the description of heading 8456 and simultaneously to the description of heading 8457 to 8461, 8464 or 8465 is classified in heading 8456.

4. Heading 8457 covers only metalworking machines other than lathes (including multipurpose lathes) which may perform different types of machining operations by:

(a) the automatic replacement of tools from a tool store or similar device in accordance with the processing program(s);

(b) the automatic application simultaneously or sequentially of different processing heads operating at a fixed workpiece (assembly single-position machines); or

(c) automatic movement of the workpiece to various processing heads (multi-position machines).

5. For the purposes of heading 8462, the term “longitudinal cutting line” for flat products means a process line consisting of a winder, a correct device, a longitudinal cutting device and a winder. The term “cross-cutting line” for flat products means a process line consisting of a unwinder, a correct device and a cutting device.

6. (A) For the purposes of heading 8471, the term “computers” means machines capable of:

(i) store the processing program or programs and at least the information currently necessary to execute the program;

(ii) be freely reprogrammable according to user requirements;

(iii) perform user-defined arithmetic calculations; and

(iv) perform, without human intervention, a processing program requiring the computer to modify its actions by making logical decisions during processing.

(B) Computing machines can be made in the form of systems consisting of a different number of individual blocks.

(C) Subject to the provisions of Notes (D) and (E) below, a block shall be treated as part of a computing system if it satisfies all of the following conditions:

(i) exclusively or principally used in a computing system;

(ii) is capable of being connected to the central processing unit either directly or through one or more other units; and

(iii) is capable of receiving or presenting information in such form (codes or signals) as may be used by the system.

Separately presented computer units are classified in heading 8471.

However, keyboards, X-Y-coordinate input devices and disk storage units which satisfy the conditions laid down in Notes (B) (ii) and (B) (iii) above are in all cases to be regarded as blocks of heading 8471.

(D) Heading 8471 does not cover the following devices, presented separately, even if they meet all the conditions of Note 6(C) above:

(i) printers, copiers, facsimile machines, combined or not;

(ii) apparatus for receiving or transmitting voice, images or other data, including apparatus for providing communications over a wired or wireless communication network (for example, on a local or wide area network);

(iii) loudspeakers and microphones;

(iv) television cameras, digital cameras and video recording cameras;

(v) monitors and projectors not combined with television reception equipment.

(E) Machines containing or working in conjunction with a computer and performing specific functions other than information processing are classified in the headings according to their specific functions or, if this is not possible, in the residual headings.

7. Heading 8482, inter alia, covers polished steel balls whose maximum and minimum diameter does not differ from the nominal diameter by more than 1% or by more than 0.05 mm, whichever is smaller. Other steel balls are classified in heading 7326.

8. A machine which is used for more than one purpose shall be classified as if its primary purpose were the only one.

Subject to the provisions of Note 2 to this Chapter and Note 3 to Section XVI, a machine whose primary purpose is not described in any heading or a machine in which none of its functions is primary is classified in heading 8479, unless the context otherwise provides. Heading 8479 also includes machinery for the manufacture of ropes or ropes (e.g. knitting machines) from metal wire, textile yarn or other materials or from a combination of such materials.

9. For the purposes of heading 8470, the term “pocket” applies only to devices not exceeding 170 x 100 x 45 mm.

10. For the purposes of heading 8485, the term additive manufacturing (also referred to as 3D printing) means the formation of physical objects based on a digital model by successively adding and layering, sealing and curing a material (e.g., metal, plastics or ceramics).

Subject to the provisions of Note 1 to Section XVI and Note 1 to Chapter 84, machines as described in heading 8485 are classified in that heading and no other heading of the Nomenclature.

11. (A) Notes 12(a) and 12(b) to Chapter 85 also apply to the terms “semiconductor devices” and “electronic integrated circuits”, respectively, as used in this note and in heading 8486. However, in this note and in heading 8486, the term "semiconductor devices" also applies to photosensitive semiconductor devices and LEDs.

(B) In this note and in heading 8486, the term “plane display panel production” covers the fabrication of a flat panel of substrates. It does not cover the production of glass or the installation of printed circuit boards or other electronic components on flat panels. The term "flat display panel" does not apply to cathode ray tube technology.

(C) Heading 8486 also includes machinery and apparatus used exclusively or principally for:

(i) producing or eliminating defects in masks and patterns;

assemblies of semiconductor devices or electronic integrated circuits;

(iii) lifting, manipulating, loading or unloading boules, plates, semiconductor devices, electronic integrated circuits and flat display panels.

(D) Subject to the provisions of Note 1 to Section XVI and Note 1 to Chapter 84, machinery meeting the description in heading 8486 is classified in this heading and in no other heading of the Nomenclature.

Subheading notes

English text as published in Annex I to Regulation (EU) 2021/1832 (Combined Nomenclature). The EAEU tariff and the EU nomenclature copy these notes from the same convention. For a Russian declaration the binding version is the Russian one: Annex to Decision No 80 of the EEC Council of 14 September 2021.

1. For the purposes of subheading 8465 20, the term ‘machining centres’ applies only to machine-tools for working wood, cork, bone, hard rubber, hard plastics or similar hard materials, which can carry out different types of machining operations by automatic tool change from a magazine or the like in conformity with a machining programme.

2. For the purposes of subheading 8471 49, the term ‘systems’ means automatic data-processing machines whose units satisfy the conditions laid down in note 6(C) to Chapter 84 and which comprise at least a central processing unit, one input unit (for example, a keyboard or a scanner), and one output unit (for example, a visual display unit or a printer).

3. For the purposes of subheading 8481 20, the expression ‘valves for oleohydraulic or pneumatic transmissions’ means valves which are used specifically in the transmission of ‘fluid power’ in a hydraulic or pneumatic system, where the energy source is supplied in the form of pressurized fluids (liquid or gas). These valves may be of any type (for example, pressure-reducing type, check type). Subheading 8481 20 takes precedence over all other subheadings of heading 8481.

4. Subheading 8482 40 applies only to bearings with cylindrical rollers of a uniform diameter not exceeding 5 mm and having a length which is at least three times the diameter. The ends of the rollers may be rounded.

Additional notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. For the purposes of subheadings 8407 10 and 8409 10, the term “aviation engines” shall apply only to engines intended for assembly with an air or rotor.

2. В подсубпозицию 8471 70 300 0 также включаются устройства считывания компакт-дисков, являющиеся запоминающими устройствами вычислительных машин, которые предназначены для считывания сигналов с CD-ROM, аудиокомпакт-дисков и фотокомпакт-дисков и снабжены разъемом для наушников, регулятором громкости или кнопкой пуск/стоп.

Additional notes of the Eurasian Economic Union

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. For the purposes of subheading 8482 10 900 1, the term “gross mass” means the total mass of the goods with all kinds of packaging materials and packagings ensuring their safety during storage and transport. The total weight of the goods does not include the mass of packaging materials or containers that are clearly suitable for reuse.

2. For the purposes of subheading 8415 81 001 0, the term “special production facilities” means premises in which the maintenance of precise values of temperature and humidity is due to the operational requirements of the equipment installed therein, such as machines, computers, switching equipment, surgical equipment, etc., or to the operations performed therein.

3. In subheadings 8427 20 190 1, 8427 90 000 1 and 8436 80 100 1, the date of manufacture shall be determined on the basis of the technical documentation of the manufacturer (technical passport, instruction manual) and the manufacturer's plate, which shall be fixed in a conspicuous, easily accessible place of the machinery and shall not be replaced during operation. If the manufacturer's technical documentation and the manufacturer's plate contain conflicting information about the date of manufacture or there is no information about the manufacturer of the equipment on the date of manufacture, then this technique is considered a technique, since the release of which more than 3 years have passed.

If the manufacturer's information indicates only the year of manufacture, then the date of manufacture of the equipment is considered 1 July of the year of manufacture; if the month and year of manufacture are indicated, the date of manufacture is the 15th day of the month specified in the manufacturer's information.

4. For the purpose of classification of goods in subheading 8482 10 900 1 in the states, whose territories constitute the customs territory of the Eurasian Economic Union, when applying the term "French border of the country of importation", the country of import is understood as the customs territory of the Eurasian Economic Union.

5. For the purpose of subheading 8407 10 000 3, the term “take-off power” means the maximum power developed by an aircraft piston engine.

“Take-off power” is specified in the technical documentation and (or) accompanying documents, measured in kilowatts or horsepower (1 kW corresponds to 1.35962 hp).

6. В подсубпозиции 8421 99 000 5 термин «элементы мембранные рулонного типа для фильтрования или очистки жидкостей» означает устройства цилиндрической формы, состоящие из:

- internal plastic perforated tube on which spirally wound membrane bags;

- drainage material located between membrane bags and glued to them on three sides.

The membrane package consists of a twice folded band of membrane containing an extruded grid inside.

At the ends of the membrane roll-type element, fixing discs and sealing cuffs can be installed.

7. For the purposes of subheading 8415 20 000 2, the term “in a single enclosure” refers to air conditioning units (air conditioners) in which all the elements are combined in a single enclosure, frame or platform.

The term "in a single housing" also applies to air conditioning units (air conditioners) in which the refrigeration compressor, which is part of a given air conditioning unit (air conditioner), is located separately, that is, not combined with the rest of the elements in one housing, on one frame or on one platform.