8515 31 — Fully or partly automatic machines for arc welding of metals, incl. plasma arc welding

8515 Electric (including electrically heated gas), laser or other light or photon beam, ultrasonic, electron beam, magnetic pulse or plasma arc soldering, brazing or welding machines and apparatus, whether or not capable of cutting; electric machines and apparatus for hot spraying of metals or cermets: – Brazing or soldering machines and apparatus: 8515 11 – – Soldering irons and guns 8515 19 – – Other – Machines and apparatus for resistance welding of metal: 8515 21 – – Automatic or semi-automatic 8515 29 – – Other – Machines and apparatus for arc (including plasma arc) welding of metals: 8515 31 – – Automatic or semi-automatic 8515 39 – – Other 8515 80 – Other machines and apparatus 8515 90 – Parts

(i) Machines and apparatus for low-temperature soldering, high-temperature soldering or welding This category of machinery includes certain machines and apparatus for low-temperature soldering, high-temperature soldering or welding, portable or stationary. They are also included in this heading if cutting operations can also be performed on them. Welding operations can be performed manually or fully or partially in automated mode. (A) Machinery for low-temperature or high-temperature soldering. Heat is usually obtained through induction or conductivity from electrical sources. Low-temperature and high-temperature soldering are operations in which metal parts are joined together by a filling metal with a lower melting point that wets the base metal(s). The metal(s) of the base does not participate in the fusion process during the formation of the compound. Additive metal is usually distributed between the surfaces of the compound by capillary attraction. High-temperature soldering differs from low-temperature soldering by the melting point of the additive metals used. With high-temperature soldering, the temperature usually exceeds 450 °C, whereas with low-temperature soldering, the melting point is reached at a lower temperature. This category includes only such machines and apparatus which, by virtue of their special devices (e.g. soldering wire system) can be defined as machines and apparatus designed exclusively or mainly for low-temperature or high-temperature soldering. Other devices should be

to be regarded as furnaces, chambers or heating equipment as defined in heading 8514. This heading also includes hand soldering irons and electric-heated soldering pistols. (B) Machines and apparatus for welding metals by resistance. The thermal energy required for the formation of welds is formed due to the resistance to electric current flowing through the connected parts (joule heat). When welding, these parts are pressed against each other under pressure, and flux or filler metal is not used. There are machines of many kinds according to the type of welded product. This includes, for example, joint welding machines or melting welding machines; point welding machines including pistols with and without built-in sludge power supplies; multipoint welding machines and accessories; relief welding machines; high-frequency resistance welding machines. (C) Machines and apparatus for arc or plasma arc welding of metals, whether or not they can perform cutting operations. (1) Arc welding. The source of thermal energy is an electrical arc formed either between two electrodes or between one such electrode and the workpiece. There are many types of machines of this type, for example, for manual arc welding of metal with coated electrodes; for arc welding in a protective gas environment; for welding or cutting with consumable or non-consumable electrodes or with a protected arc (arc welding of a melting electrode in an inert gas environment; arc welding with a melting electrode in an active gas medium; arc welding with a tungsten electrode in an inert gas medium; arc welding under a flux; electric slag welding or electrogas welding). (2) Plasma arc welding. The source of thermal energy is a compressed arc, which by ionization and dissociation converts the auxiliary gas into plasma (plasma jet). The gas can be inert (argon, helium), polyatomic (nitrogen, hydrogen), or it can be a mixture of two gases. (D) Machines and apparatus for induction welding of metals. Thermal energy is generated by passing current through one or more inductors. (E) Machines and apparatus for electron beam welding, whether or not they can perform cutting operations. Thermal energy arises in the welded or cut parts (parts) due to the collisions of electrons of a focused electron beam obtained in a vacuum. (F) Machinery for vacuum diffusion welding. Thermal energy usually arises under the action of induction, but its source can also be a beam of electrons or resistance.

The device mainly consists of a vacuum chamber, a vacuum pump, means of applying pressure and heating equipment. Machines and apparatus for photonic welding, whether they can perform cutting operations or not. Photonic welding can be of the following types: (1) Laser welding. Thermal energy is provided by a source of coherent monochromatic radiation that can be focused into a high intensity beam. Thermal energy occurs when this beam falls on the welded part. (2) Light welding. Thermal energy occurs when an incoherent focused light beam falls. (H) Machines and apparatus for welding thermoplastic materials. (1) Electrically heated gas welding (heated gas welding). The welded surfaces are heated by a gas (usually air), a heated electric heater, and joined together under pressure with or without additives. (2) Welding with elements heated by electricity (welding with heating elements). The welded surfaces are heated by elements heated by electricity and pressurized with or without additives. (3) High frequency welding. Surfaces of thermoplastic materials (e.g., acrylic polymers, polyethylene, polyvinyl chloride, polyamide (e.g., nylon)) having sufficiently high dielectric losses are heated in a high-frequency oscillation field and then combined under pressure. Additives may be used. (i) Machines and apparatus for ultrasonic welding. The welded parts are fastened together and exposed to ultrasonic vibrations. This process makes it possible to connect metals or alloys that are not amenable to conventional welding methods, as well as weld metal foil, parts of two or more dissimilar metals or polymer films. To power electrical installations for low-temperature soldering, high-temperature soldering or welding, a low-voltage direct current from a DC generator or a low-voltage alternating current from a step-down transformer is typically used. The transformer, etc., is usually incorporated into the installation, but in some cases (for example, in some types of mobile installations), the welding head or welding device is connected to the transformer, etc. by means of an electric cable. Even in the latter case, the whole apparatus is included in this heading, provided that the transformer, etc., is presented with the corresponding welding head or welding appliance; if presented separately, the transformer or generator is classified in the appropriate heading (heading 8502 or 8504). This heading also includes industrial robots, specifically

intended for welding operations. This heading also excludes: (a) packing equipment equipped with electrical welding appliances (heading 8422); (b) presses for thermofixation of materials (heading 8451); (c) machines intended exclusively for cutting (generally heading 8456); (d) friction welding machines (heading 8468); (e) machines and apparatus for low-temperature soldering, high-temperature soldering or welding used exclusively or mainly for the assembly of semiconductors (heading 8486). (II) Electrical arc machines and devices for the hot spraying of metals or metal ceramics are electrical arc devices for the melting of metals or metal ceramics with simultaneous spraying of molten material with compressed air. This heading does not cover separately presented pistols for spraying metals (heading 8424). Subject to the general provisions relating to the classification of parts (see the general provisions of Section XVI), parts of the articles of this heading are also included in this heading. This includes, inter alia, soldering decoys and soldering stingers, electric supporters and metal electrodes of the contact welding machine (e.g., point roller and clamping electrodes), as well as burner tips and nozzles for manual equipment for nuclear-hydrogen welding. This heading, however, does not cover: (a) consumable electrodes made of base metal or of metal carbides (considered either in accordance with the material of which they are made or in heading 8311 as the case may be); (b) electrodes of graphite or other forms of carbon with or without metal (heading 8545).

Notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. This group does not include:

(a) blankets, mattresses, pillows, foot warmers, electrically heated or similar articles; clothing, shoes or headphones or other electrically heated articles used by a person;

(b) glass articles of heading 7011;

(c) machinery and apparatus of heading 8486;

(d) vacuum apparatus used in the medical, surgical, dental or veterinary fields of science (heading 9018); or

(e) Electrically heated furniture of Chapter 94.

2. Headings 8501 to 8504 do not cover the goods of heading 8511, 8512, 8540, 8541 or 8542.

However, mercury arc rectifiers with metal reservoirs are classified in heading 8504.

3. For the purposes of heading 8507, the term “electrical accumulators” applies to electric accumulators presented with additional components that contribute to the storage and supply of energy to the battery or protect it from damage, such as electrical connectors, thermostats (e.g., thermistors) and protective devices. They may also include a portion of the protective casing of the goods in which they will be used.

4. Heading 8509 covers only the following types of electromechanical machinery commonly used in household use:

(a) canvases, food grinders, mixers and juicers for fruits or vegetables of any mass;

(b) other machines weighing not more than 20 kg.

Однако данная товарная позиция не включает вентиляторы или вентиляционные или рециркуляционные вытяжные колпаки или шкафы с вентилятором, с фильтрами или без фильтров (товарная позиция 8414), центробежные сушилки для белья (товарная позиция 8421), посудомоечные машины (товарная позиция 8422), бытовые стиральные машины (товарная позиция 8450), валковые или другие гладильные машины (товарная позиция 8420 или 8451), швейные машины (товарная позиция 8452), электрические ножницы (товарная позиция 8467) или электронагревательные приборы (товарная позиция 8516).

5. For the purposes of heading 8517, the term “smartphones” means telephones for cellular communication networks equipped with a mobile operating system designed to perform computer functions, such as the downloading and simultaneous operation of several applications, including third-party applications, whether or not other components, such as digital cameras and navigation systems, are embedded therein.

6. In heading 8523:

(a) “solid state-of-the-art non-volatile storage devices” (e.g., “flash memory cards” or “electronic flash memory cards”) mean connector storage devices comprising one or more flash memory devices (e.g., “Flash ES ROMs”) in the form of integrated circuits installed on a printed circuit board. They may include an integrated circuit controller and discrete passive components such as capacitors and resistors.

(b) the term “smart cards” means cards that have one or more electronic integrated circuits (a microprocessor, randomly sampled memory (ROM) or permanent memory (ROM)) in the form of crystals. These cards may have contacts, a magnetic strip, or a built-in antenna, but they do not contain any other active or passive elements.

7. For the purposes of heading 8524, the expression “flat display panel modules” refers to display devices or apparatus equipped with at least a display screen which are designed to be incorporated into the articles of other headings before use. In shape, the display screens of such modules can be flat, curved, flexible, folding, stretching or other shapes. Flat display panel modules may include additional components, including those necessary for receiving video signals and distributing them across screen pixels. Heading 8524, however, does not include display modules equipped with components for converting video signals (e.g., a video format conversion integrated circuit, a decoder integrated circuit or an application processor) or otherwise having assumed the character of articles of other headings.

In classifying the flat panel modules referred to in this note, heading 8524 takes precedence over any other heading of the Nomenclature.

8. For the purposes of heading 8534, the term “printed circuits” means circuits made by forming on an insulating substrate by any printing process (e.g., electroplating, etching) or by “film” technology of conductors, contacts, or other printed elements (e.g., inductances, resistors, capacitors) individually or in a particular order, with the exception of elements which are capable of producing, straightening, modulating, or amplifying an electrical signal (e.g., semiconductor elements).

The term "printed circuits" does not include circuits combined with elements other than those obtained in the printing process, as well as individual discrete resistors, capacitors or inductors. Printed circuits, however, may be equipped with connecting elements manufactured by a technology other than printing.

Thin or thick-film circuits employing passive and active elements obtained in the same process are classified in heading 8542.

9. For the purposes of heading 8536, the term “connectors for fibers of optical, fiber-optic harnesses or cables” means connectors which simply mechanically connect the ends of optical fibers in a digital link system. They do not perform any other function, such as amplifying, restoring, or changing a signal.

10. Heading 8537 excludes wireless infrared devices for remote control of television receivers or other electrical equipment (heading 8543).

11. For the purposes of heading 8539, the expression “LED light sources” covers:

(a) "LED modules" are electric light sources based on LEDs connected in electrical circuits and containing additional components such as electrical, mechanical, thermal or optical elements. For supply or control of power, these modules also contain discrete active elements, discrete passive elements or articles of heading 8536 or 8542. LED modules (LED) are not equipped with a cap, facilitating installation or replacement in the lamp, and providing mechanical and electrical contact;

(b) "LED lamps" are electrical light sources containing one or more LED modules containing additional components such as electrical, mechanical, thermal or optical elements. The difference between LED modules (LED) and LED lamps (LED) is that the latter have a cap that facilitates installation or replacement in the lamp, and provides mechanical and electrical contact.

12. In headings 8541 and 8542:

(a) (i) “semiconductor devices” means semiconductor devices whose operation is based on a change in their resistance under the action of an electric field or semiconductor-based transducers.

Semiconductor devices may also comprise an assembly of multiple elements, regardless of whether the devices are provided with active and passive auxiliary functions or not.

For the purposes of this definition, “semiconductor-based transducers” are semiconductor-based sensors, semiconductor-based actuators, semiconductor-based resonators, and semiconductor-based generators that are varieties of discrete semiconductor-based devices that perform a given function and are capable of converting any physical or chemical phenomenon or effect into an electrical signal, or an electrical signal into some physical phenomenon or action.

All elements of transducers based on semiconductors are inextricably combined with each other, and can contain inseparably attached to them materials necessary for their design or functioning.

The following expressions have the following meanings:

(1) “semiconductor-based” means created or manufactured on a semiconductor substrate or made of semiconductor materials, in a semiconductor technology in which a semiconductor substrate or material plays an essential and irreplaceable role in the performance by a converter of its function, the operation of which is based on the properties of the semiconductor, including physical, electrical, chemical and optical properties;

(2) “physical or chemical phenomena” refers to phenomena such as pressure, acoustic waves, acceleration, vibration, motion, orientation, stress, magnetic field strength, electric field strength, light, radioactivity, humidity, flow rate, concentration of chemicals, etc.;

(3) "semiconductor-based sensor" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of determining the values of physical or chemical action and their conversion into electrical signals caused by a change in electrical properties or displacement of the mechanical structure.

(4) "semiconductor-based drive" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of converting electrical signals into physical motion;

(5) "semiconductor-based resonator" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor, and having the function of generating mechanical or electrical oscillations of a given frequency, depending on the physical geometry of these structures responding to an external input signal;

(6) "semiconductor-based generator" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of generating mechanical or electrical oscillations of a given frequency, depending on the physical geometry of these structures;

(ii) "LEDs (LEDs)" are semiconductor devices based on semiconductor materials that convert electrical energy into visible, infrared or ultraviolet radiation, whether electrically connected or unconnected, combined with protective diodes or not combined. The LEDs of heading 8541 do not contain components intended to provide power supply or control power supply.

(b) "electronic integrated circuits":

(i) monolithic integrated circuits in which circuit elements (diodes, transistors, resistors, capacitors, inductances, etc.) are carried out in mass (mainly) and on the surface of a semiconductor or complex semiconductor material (for example, doped silicon, gallium arsenide, silicohermanium, indium phosphide) and are inseparably linked;

(ii) hybrid integrated circuits in which passive elements (resistors, capacitors, inductances, etc.) made by thin- or thick-film technology processes and active elements (diodes, transistors, monolithic integrated circuits, etc.) obtained by semiconductor technology processes are connected into a single inseparable whole by interconnections or connecting cables on a single insulating substrate (glass, ceramics, etc.). Such circuits may also contain discrete components;

(iii) multi-crystal integrated circuits consisting of two or more interconnected monolithic integrated circuits, inseparably combined into a single whole, located or not located on one or more insulating substrates, having or not having a frame with terminals, but containing no other active or passive elements;

(iv) multi-component integrated circuits consisting of one or more monolithic, hybrid or multi-crystal integrated circuits combined with at least one of the following components: silicon-based sensors, silicon-based actuators, silicon-based generators, silicon-based resonators or combinations thereof, or components performing the functions of articles classified in headings 8532, 8533, 8541, or inductors classified in heading 8504, inseparably combined in a single integrative form of a single integrated circuit, carried by means of a connection with a printed terminal or other terminal.

In this definition:

(1) “Components” may be discrete, produced independently, then installed on the rest of the multi-component integrated circuit, or integrated into other components;

(2) “Silicon-based” means that they are made on a silicon substrate, or are made of silicon, or are made on an integrated circuit chip;

(3)(a) “silicon-based sensors” consist of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and have the function of detecting physical or chemical phenomena and converting them into electrical signals caused by a change in electrical properties or displacement of the mechanical structure. “Physical or chemical phenomena” refer to phenomena such as pressure, acoustic waves, acceleration, vibration, motion, orientation, stress, magnetic field strength, electric field strength, light, radioactivity, humidity, flow rate, concentration of chemicals, etc.;

(b) “silicon-based actuators” consist of microelectronic and mechanical structures that are created in the mass or on the surface of the semiconductor and that have the function of converting electrical signals into physical motion;

(c) “silicon-based resonators” are components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating mechanical or electrical oscillations of a given frequency depending on the physical geometry of these structures responding to an external input signal;

(d) “silicon-based generators” are active components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating mechanical or electrical oscillations of a given frequency depending on the physical geometry of those structures.

In classifying the articles referred to in this note, headings 8541 and 8542 shall take precedence over any other heading of the Nomenclature which may include those articles in accordance with, in particular, their function, with the exception of heading 8523.

Subheading notes

English text as published in Annex I to Regulation (EU) 2021/1832 (Combined Nomenclature). The EAEU tariff and the EU nomenclature copy these notes from the same convention. For a Russian declaration the binding version is the Russian one: Annex to Decision No 80 of the EEC Council of 14 September 2021.

1. Subheading 8525 81 covers only high-speed television cameras, digital cameras and video camera recorders having one or more of the following characteristics: - writing speed exceeding 0,5 mm per microsecond; - time resolution 50 nanoseconds or less; - frame rate exceeding 225 000 frames per second.

2. In respect of subheading 8525 82, radiation-hardened or radiation-tolerant television cameras, digital cameras and video camera recorders are designed or shielded to enable operation in a high-radiation environment. These cameras are designed to withstand a total radiation dose of at least 50 × 103 Gy(silicon) (5 × 106 RAD (silicon)), without operational degradation.

3. Subheading 8525 83 covers night vision television cameras, digital cameras and video camera recorders which use a photocathode to convert available light to electrons, which can be amplified and converted to yield a visible image. This subheading excludes thermal imaging cameras (generally subheading 8525 89).

4. Subheading 8527 12 covers only cassette-players with built-in amplifier, without built-in loudspeaker, capable of operating without an external source of electric power and the dimensions of which do not exceed 170 mm × 100 mm × 45 mm.

5. For the purposes of subheadings 8549 11 to 8549 19, ‘spent primary cells, spent primary batteries and spent electric accumulators’ are those which are neither usable as such because of breakage, cutting-up, wear or other reasons, nor capable of being recharged.

Additional notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. Subheadings 8519 20 100 0, 8519 30 000 0 and 8519 89 110 0 do not include sound-reproducing apparatus with a laser reading system.

2. Примечание к субпозиции 4 применимо при внесении соответствующих изменений к подсубпозициям 8519 81 150 0 и 8519 81 650.

3. For the purposes of subheadings 8528 71 150 0 and 8528 71 910 0 only, the term “modem” means devices or equipment which modulate outgoing and demodulate incoming signals, such as V.90 modems or cable modems and other devices which use similar technologies to access the Internet via WLAN, ISDN and Ethernet. Access to the Internet may be limited by the service provider.

The apparatus of these subheadings shall provide for a bidirectional communication process or a bidirectional flow of information in order to facilitate the interactive exchange of information.

Additional notes of the Eurasian Economic Union

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. For the purposes of subheading 8542 31 100 1, the term “process not exceeding 32 nanometers” means a process for the manufacture of electronic integrated circuits in accordance with the technological standards of which the gates of the logical transistors of a microprocessor do not exceed 32 nanometers. Logical transistors are the main computational elements of a microprocessor that implement all arithmetic and logical operations. The gate is the control element of the transistor. Data on the technological process of manufacturing microprocessors are given in the manufacturer's technical documentation, which may be submitted by its authorized representative in the member states of the Eurasian Economic Union.

2. For the purposes of subheading 8535 90 000 1, the term “passage insulators” means devices attached to the flanges of the compartments of modules forming part of a complete switchgear of an elegasic unit (CSG) and intended to separate gas volumes between these compartments or to combine the various CSG modules into a single gas volume, as well as connections through the electrodes of conductors of the CSGM modules built into the passage insulators among themselves during the assembly of the CSGM. Passage insulators are gas dense and non-gas dense. With the help of gas-dense insulators, the gas volumes of KREE are separated. With the help of non-gas-dense insulators, various CSRE modules are combined into one gas volume. Passage insulators consist of a flange ring, a cast insulator and electrodes poured into the insulator.