8542 39 100 0 — Electronic integrated circuits: electronic integrated circuits: other: goods specified in Note 12 (b) (iii) to this Chapter

8542 Electronic integrated circuits: – electronic integrated circuits: 8542 31 – processors and controllers, combined or not combined with memory devices, converters, logic circuits, amplifiers, synchronizers or other circuits 8542 32 – – memory devices 8542 33 – amplifiers 8542 39 – other 8542 90 – parts

The articles of this heading are defined in Note 9(b) to this Chapter. Electronic integrated circuits are devices having a high density of passive and active elements or components, which are considered as separate blocks. (For elements or components considered to be “passive” or “active”, see the HS Explanatory Note to heading 8534, first paragraph.) However, electronic circuits containing only passive elements are not included in this heading.

Unlike electronic integrated circuits, discrete components can have a single active electrical function (semiconductor devices defined by Note 9 (a) to Chapter 85) or a single passive electrical function (resistors, capacitors, interconnections, etc.). Discrete components are indivisible and are the basic electronic building blocks of a system. However, components consisting of several electrical circuit elements and having a multiplicity of electrical functions, such as integrated circuits, are not regarded as discrete components. Electronic integrated circuits include memories (e.g., DRAMs, SRAMs, PROMs, EPROMs, EEPROMs), microcontrollers, control circuits, logic circuits, gate arrays, interface circuits, etc. Electronic integrated circuits comprise: (I) Monolithic integrated circuits. These are microcircuits in which the circuit elements (diodes, transistors, resistors, capacitors, interconnections, etc.) are created in the mass (essentially) and on the surface of a semiconductor material (e.g., doped silicon) and are therefore inseparably associated. Monolithic integrated circuits may be digital, linear (analogue) or analogue-digital. Monolithic integrated circuits may be presented: (i) mounted, i.e., with their leads or connecting conductors, whether or not encapsulated in ceramic, metal or plastics. The housings may be cylindrical, parallelepiped-shaped, etc.; (ii) unmounted, i.e., as chips, usually rectangular, with sides generally measuring a few millimetres; (iii) in the form of undiced wafers (i.e., not yet cut into chips). Monolithic integrated circuits include: (i) metal-oxide-semiconductor structures (MOS technology); (ii) circuits obtained by bipolar technology; (iii) circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology). Metal-oxide-semiconductor (MOS) technology, especially complementary metal-oxide-semiconductor (CMOS), and bipolar technology are the "basic" technologies used in the manufacture of transistors. As the basic components of monolithic integrated circuits, these transistors give the integrated circuits their individual character. Bipolar circuits are preferred for systems where maximum logic speed is required. On the other hand, MOS circuits are preferred for systems requiring high component density and low power consumption. Moreover, CMOS circuits have the lowest power requirements. They are therefore preferred for applications where the power supply is limited or where cooling problems are expected. The complementary relationship between bipolar and MOS technologies is brought out even further in BIMOS technology, which combines the speed of bipolar circuits with the high integration and low power consumption of CMOS circuits.

(II) Hybrid integrated circuits. They are chips formed on an insulating substrate on which a fine- or thick-film circuit was formed. This process makes it possible to simultaneously obtain some passive elements (resistors, capacitors, inductances, etc.). However, to become a hybrid integral with the heme of this heading, semiconductors must be embedded and mounted on a surface, either in the form of crystals, whether they have a housing or not, or as enclosed semiconductors (for example, specially designed miniature housings). Hybrid integrated circuits may also contain separately produced passive elements that are embedded in the main film circuit in the same way as semiconductors. Typically, these passive elements are components such as capacitors, resistors or inductances in the form of crystals. Substrates formed from several layers, usually ceramic, thermally bonded together to form a compact assembly, are to be considered as a single substrate within the meaning of Note 9(b)(ii) to this Chapter. Components forming a hybrid integrated circuit should be inseparably combined into a single whole, that is, although some of the elements could theoretically be removed and replaced, this would represent a long and tedious work that is uneconomical under normal production conditions. (III) Multi-crystal integrated circuits. They consist of two or more interconnected monolithic integrated circuits, inseparably combined into a single whole, located or not located on one or more insulating substrates, having or not having a frame with terminals, but containing no other active or passive elements. Multi-crystal integrated circuits are usually presented in the following configurations: – two or more monolithic integrated circuits located adjacent; – two or more monolithic integrated circuits stacked on top of each other; – combinations of the above configurations of three or more monolithic integrated circuits. These monolithic integrated circuits are combined and connected together into a single whole and can be packaged by encapsulation or in any other way. They are inseparably united into a single whole, that is, despite the theoretical possibility of removing and replacing some elements, this will be a task requiring large time expenditures, which will be unprofitable under ordinary conditions of production. The insulating substrates of multi-chip integrated circuits may comprise electrically conductive portions. These sections may consist of special materials or have a special form for performing passive functions by means that are not discrete elements of the circuits. If conduction portions are located on the substrate, they are usually used as means of connecting monolithic integrated circuits with each other. Such substrates may also be referred to as "inserts" or "separators" when placed above the lowest crystal or matrix. Monolithic integrated circuits are connected by various means, such as adhesive compounds, wire connections or “inverted crystal” technology.

Multicomponent integrated circuits (MCOs). Multicomponent integrated circuits are combinations of circuits and elements listed in Note 9(b)(iv) to this Chapter. Multi-component integrated circuits are combinations of one or more monolithic, hybrid or multi-chip integrated circuits, or with silicon-based sensors, silicon-based actuators, silicon-based resonators, silicon-based generators and combinations thereof, or with one or more components performing the functions of articles classified in headings 8532, 8533, 8541, or inductors classified in heading 8504. This category also includes multi-component integrated circuits containing other multi-component integrated circuits if they meet the conditions of Note 9(b)(iv) to Chapter 85. The definition of multi-component integrated circuits does not include all individual (tradeable) devices not covered by heading 8504, 8532, 8533, 8541 or not covered by the definition of sensors, actuators, resonators, generators or combinations thereof (e.g. transformers (heading 8504) or magnets (heading 8505)). However, other elements that are not mentioned but are an integral or necessary part of multi-component integrated circuits (or integrated circuit housings), such as substrates that function or do not function as circuit boards, gold wires or conductive portions, or that are necessary for their creation and operation, such as a molding compound or terminal frame, are considered to be parts/elements of multi-component integrated circuits. Integrated circuits and elements forming multi-component integrated circuits are combined and connected physically, electrically or optically in one or a single housing (an element existing as a piece or independent technical unit with a common connection to the outside world through contact pins, wires, ball terminals, contact pads or column terminals), on one or more insulating substrates, with output frames or without x, and can be packaged by encapsulation or any other means. These elements must be inseparably combined into a single whole, that is, despite the theoretical possibility of removing and replacing some elements, it will be unprofitable under ordinary conditions of production. Multi-component integrated circuits are often designed for installation, in which their terminals are installed in or on a support base (for example, printed circuit boards, or other bases, such as thick-film, thin-film, insulated metal substrates, etc.), or connected to an electrical connector. The housings of multicomponent integrated circuits can be made of various materials, have different design and shape and protect the assembly from mechanical and external influences. Multicomponent integrated circuits may have various features (e.g., the housing may be integral, or have holes, windows, or membranes) or adaptations necessary to perform certain functions. In multi-component integrated circuits, these various features and devices are used to receive data on external physical or chemical impacts and process this data to generate output signals or mechanical reactions in accordance with silicon-based sensors, silicon-based actuators, silicon-based resonators, silicon-based generators.

Their fields of application are diverse, including computers, telecommunications equipment (e.g., telephones for cellular networks), consumer goods, industrial equipment or motor vehicles. The heading excludes film circuits consisting only of passive elements (heading 8534). The heading excludes solid-state non-volatile storage devices, "smart cards" and other media for the recording of sound or of other phenomena (see heading 8523 and Note 5 to this Chapter). Except for the combinations (inseparably combined into a single whole) referred to above in Parts (II), (III) and (IV) concerning hybrid integrated circuits, multichip integrated circuits and multi-component integrated circuits (MCOs), the heading also excludes assemblies formed by: (a) mounting one or more discrete components on a support formed, for example, by a printed circuit; (b) adding one or more devices, such as a diode, transformer or resistor, to an electronic microcircuit; (c) combining discrete components or combining electronic microcircuits, other than multichip or multi-component integrated circuits; or (d) combining one or more monolithic, hybrid, multichip or multi-component integrated circuits with components not referred to in Note 9 (b) (iv) to this Chapter (e.g., transformers (heading 8504) or magnets (heading 8505)). Such assemblies are classified as follows: (i) assemblies forming a complete machine or apparatus (or an entity regarded as complete) are classified in the heading appropriate to the machine or apparatus; (ii) other assemblies – in accordance with the provisions governing the classification of parts of machines (Notes 2 (b) and 2 (c) to Section XVI, in particular). This applies, in particular, to certain electronic memory modules (e.g., SIMMs (single in-line memory modules) and DIMMs (dual in-line memory modules)). These modules are to be classified by application of Note 2 to Section XVI. (See the General Explanatory Note to this Chapter.) PARTS Subject to the general provisions regarding the classification of parts (see the General Explanatory Note to Section XVI), parts of the goods of this heading are classified in this heading.

Notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. This group does not include:

(a) blankets, mattresses, pillows, foot warmers, electrically heated or similar articles; clothing, shoes or headphones or other electrically heated articles used by a person;

(b) glass articles of heading 7011;

(c) machinery and apparatus of heading 8486;

(d) vacuum apparatus used in the medical, surgical, dental or veterinary fields of science (heading 9018); or

(e) Electrically heated furniture of Chapter 94.

2. Headings 8501 to 8504 do not cover the goods of heading 8511, 8512, 8540, 8541 or 8542.

However, mercury arc rectifiers with metal reservoirs are classified in heading 8504.

3. For the purposes of heading 8507, the term “electrical accumulators” applies to electric accumulators presented with additional components that contribute to the storage and supply of energy to the battery or protect it from damage, such as electrical connectors, thermostats (e.g., thermistors) and protective devices. They may also include a portion of the protective casing of the goods in which they will be used.

4. Heading 8509 covers only the following types of electromechanical machinery commonly used in household use:

(a) canvases, food grinders, mixers and juicers for fruits or vegetables of any mass;

(b) other machines weighing not more than 20 kg.

Однако данная товарная позиция не включает вентиляторы или вентиляционные или рециркуляционные вытяжные колпаки или шкафы с вентилятором, с фильтрами или без фильтров (товарная позиция 8414), центробежные сушилки для белья (товарная позиция 8421), посудомоечные машины (товарная позиция 8422), бытовые стиральные машины (товарная позиция 8450), валковые или другие гладильные машины (товарная позиция 8420 или 8451), швейные машины (товарная позиция 8452), электрические ножницы (товарная позиция 8467) или электронагревательные приборы (товарная позиция 8516).

5. For the purposes of heading 8517, the term “smartphones” means telephones for cellular communication networks equipped with a mobile operating system designed to perform computer functions, such as the downloading and simultaneous operation of several applications, including third-party applications, whether or not other components, such as digital cameras and navigation systems, are embedded therein.

6. In heading 8523:

(a) “solid state-of-the-art non-volatile storage devices” (e.g., “flash memory cards” or “electronic flash memory cards”) mean connector storage devices comprising one or more flash memory devices (e.g., “Flash ES ROMs”) in the form of integrated circuits installed on a printed circuit board. They may include an integrated circuit controller and discrete passive components such as capacitors and resistors.

(b) the term “smart cards” means cards that have one or more electronic integrated circuits (a microprocessor, randomly sampled memory (ROM) or permanent memory (ROM)) in the form of crystals. These cards may have contacts, a magnetic strip, or a built-in antenna, but they do not contain any other active or passive elements.

7. For the purposes of heading 8524, the expression “flat display panel modules” refers to display devices or apparatus equipped with at least a display screen which are designed to be incorporated into the articles of other headings before use. In shape, the display screens of such modules can be flat, curved, flexible, folding, stretching or other shapes. Flat display panel modules may include additional components, including those necessary for receiving video signals and distributing them across screen pixels. Heading 8524, however, does not include display modules equipped with components for converting video signals (e.g., a video format conversion integrated circuit, a decoder integrated circuit or an application processor) or otherwise having assumed the character of articles of other headings.

In classifying the flat panel modules referred to in this note, heading 8524 takes precedence over any other heading of the Nomenclature.

8. For the purposes of heading 8534, the term “printed circuits” means circuits made by forming on an insulating substrate by any printing process (e.g., electroplating, etching) or by “film” technology of conductors, contacts, or other printed elements (e.g., inductances, resistors, capacitors) individually or in a particular order, with the exception of elements which are capable of producing, straightening, modulating, or amplifying an electrical signal (e.g., semiconductor elements).

The term "printed circuits" does not include circuits combined with elements other than those obtained in the printing process, as well as individual discrete resistors, capacitors or inductors. Printed circuits, however, may be equipped with connecting elements manufactured by a technology other than printing.

Thin or thick-film circuits employing passive and active elements obtained in the same process are classified in heading 8542.

9. For the purposes of heading 8536, the term “connectors for fibers of optical, fiber-optic harnesses or cables” means connectors which simply mechanically connect the ends of optical fibers in a digital link system. They do not perform any other function, such as amplifying, restoring, or changing a signal.

10. Heading 8537 excludes wireless infrared devices for remote control of television receivers or other electrical equipment (heading 8543).

11. For the purposes of heading 8539, the expression “LED light sources” covers:

(a) "LED modules" are electric light sources based on LEDs connected in electrical circuits and containing additional components such as electrical, mechanical, thermal or optical elements. For supply or control of power, these modules also contain discrete active elements, discrete passive elements or articles of heading 8536 or 8542. LED modules (LED) are not equipped with a cap, facilitating installation or replacement in the lamp, and providing mechanical and electrical contact;

(b) "LED lamps" are electrical light sources containing one or more LED modules containing additional components such as electrical, mechanical, thermal or optical elements. The difference between LED modules (LED) and LED lamps (LED) is that the latter have a cap that facilitates installation or replacement in the lamp, and provides mechanical and electrical contact.

12. In headings 8541 and 8542:

(a) (i) “semiconductor devices” means semiconductor devices whose operation is based on a change in their resistance under the action of an electric field or semiconductor-based transducers.

Semiconductor devices may also comprise an assembly of multiple elements, regardless of whether the devices are provided with active and passive auxiliary functions or not.

For the purposes of this definition, “semiconductor-based transducers” are semiconductor-based sensors, semiconductor-based actuators, semiconductor-based resonators, and semiconductor-based generators that are varieties of discrete semiconductor-based devices that perform a given function and are capable of converting any physical or chemical phenomenon or effect into an electrical signal, or an electrical signal into some physical phenomenon or action.

All elements of transducers based on semiconductors are inextricably combined with each other, and can contain inseparably attached to them materials necessary for their design or functioning.

The following expressions have the following meanings:

(1) “semiconductor-based” means created or manufactured on a semiconductor substrate or made of semiconductor materials, in a semiconductor technology in which a semiconductor substrate or material plays an essential and irreplaceable role in the performance by a converter of its function, the operation of which is based on the properties of the semiconductor, including physical, electrical, chemical and optical properties;

(2) “physical or chemical phenomena” refers to phenomena such as pressure, acoustic waves, acceleration, vibration, motion, orientation, stress, magnetic field strength, electric field strength, light, radioactivity, humidity, flow rate, concentration of chemicals, etc.;

(3) "semiconductor-based sensor" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of determining the values of physical or chemical action and their conversion into electrical signals caused by a change in electrical properties or displacement of the mechanical structure.

(4) "semiconductor-based drive" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of converting electrical signals into physical motion;

(5) "semiconductor-based resonator" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor, and having the function of generating mechanical or electrical oscillations of a given frequency, depending on the physical geometry of these structures responding to an external input signal;

(6) "semiconductor-based generator" is a type of semiconductor device consisting of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and having the function of generating mechanical or electrical oscillations of a given frequency, depending on the physical geometry of these structures;

(ii) "LEDs (LEDs)" are semiconductor devices based on semiconductor materials that convert electrical energy into visible, infrared or ultraviolet radiation, whether electrically connected or unconnected, combined with protective diodes or not combined. The LEDs of heading 8541 do not contain components intended to provide power supply or control power supply.

(b) "electronic integrated circuits":

(i) monolithic integrated circuits in which circuit elements (diodes, transistors, resistors, capacitors, inductances, etc.) are carried out in mass (mainly) and on the surface of a semiconductor or complex semiconductor material (for example, doped silicon, gallium arsenide, silicohermanium, indium phosphide) and are inseparably linked;

(ii) hybrid integrated circuits in which passive elements (resistors, capacitors, inductances, etc.) made by thin- or thick-film technology processes and active elements (diodes, transistors, monolithic integrated circuits, etc.) obtained by semiconductor technology processes are connected into a single inseparable whole by interconnections or connecting cables on a single insulating substrate (glass, ceramics, etc.). Such circuits may also contain discrete components;

(iii) multi-crystal integrated circuits consisting of two or more interconnected monolithic integrated circuits, inseparably combined into a single whole, located or not located on one or more insulating substrates, having or not having a frame with terminals, but containing no other active or passive elements;

(iv) multi-component integrated circuits consisting of one or more monolithic, hybrid or multi-crystal integrated circuits combined with at least one of the following components: silicon-based sensors, silicon-based actuators, silicon-based generators, silicon-based resonators or combinations thereof, or components performing the functions of articles classified in headings 8532, 8533, 8541, or inductors classified in heading 8504, inseparably combined in a single integrative form of a single integrated circuit, carried by means of a connection with a printed terminal or other terminal.

In this definition:

(1) “Components” may be discrete, produced independently, then installed on the rest of the multi-component integrated circuit, or integrated into other components;

(2) “Silicon-based” means that they are made on a silicon substrate, or are made of silicon, or are made on an integrated circuit chip;

(3)(a) “silicon-based sensors” consist of microelectronic or mechanical structures that are created in the mass or on the surface of the semiconductor and have the function of detecting physical or chemical phenomena and converting them into electrical signals caused by a change in electrical properties or displacement of the mechanical structure. “Physical or chemical phenomena” refer to phenomena such as pressure, acoustic waves, acceleration, vibration, motion, orientation, stress, magnetic field strength, electric field strength, light, radioactivity, humidity, flow rate, concentration of chemicals, etc.;

(b) “silicon-based actuators” consist of microelectronic and mechanical structures that are created in the mass or on the surface of the semiconductor and that have the function of converting electrical signals into physical motion;

(c) “silicon-based resonators” are components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating mechanical or electrical oscillations of a given frequency depending on the physical geometry of these structures responding to an external input signal;

(d) “silicon-based generators” are active components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating mechanical or electrical oscillations of a given frequency depending on the physical geometry of those structures.

In classifying the articles referred to in this note, headings 8541 and 8542 shall take precedence over any other heading of the Nomenclature which may include those articles in accordance with, in particular, their function, with the exception of heading 8523.

Subheading notes

English text as published in Annex I to Regulation (EU) 2021/1832 (Combined Nomenclature). The EAEU tariff and the EU nomenclature copy these notes from the same convention. For a Russian declaration the binding version is the Russian one: Annex to Decision No 80 of the EEC Council of 14 September 2021.

1. Subheading 8525 81 covers only high-speed television cameras, digital cameras and video camera recorders having one or more of the following characteristics: - writing speed exceeding 0,5 mm per microsecond; - time resolution 50 nanoseconds or less; - frame rate exceeding 225 000 frames per second.

2. In respect of subheading 8525 82, radiation-hardened or radiation-tolerant television cameras, digital cameras and video camera recorders are designed or shielded to enable operation in a high-radiation environment. These cameras are designed to withstand a total radiation dose of at least 50 × 103 Gy(silicon) (5 × 106 RAD (silicon)), without operational degradation.

3. Subheading 8525 83 covers night vision television cameras, digital cameras and video camera recorders which use a photocathode to convert available light to electrons, which can be amplified and converted to yield a visible image. This subheading excludes thermal imaging cameras (generally subheading 8525 89).

4. Subheading 8527 12 covers only cassette-players with built-in amplifier, without built-in loudspeaker, capable of operating without an external source of electric power and the dimensions of which do not exceed 170 mm × 100 mm × 45 mm.

5. For the purposes of subheadings 8549 11 to 8549 19, ‘spent primary cells, spent primary batteries and spent electric accumulators’ are those which are neither usable as such because of breakage, cutting-up, wear or other reasons, nor capable of being recharged.

Additional notes

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. Subheadings 8519 20 100 0, 8519 30 000 0 and 8519 89 110 0 do not include sound-reproducing apparatus with a laser reading system.

2. Примечание к субпозиции 4 применимо при внесении соответствующих изменений к подсубпозициям 8519 81 150 0 и 8519 81 650.

3. For the purposes of subheadings 8528 71 150 0 and 8528 71 910 0 only, the term “modem” means devices or equipment which modulate outgoing and demodulate incoming signals, such as V.90 modems or cable modems and other devices which use similar technologies to access the Internet via WLAN, ISDN and Ethernet. Access to the Internet may be limited by the service provider.

The apparatus of these subheadings shall provide for a bidirectional communication process or a bidirectional flow of information in order to facilitate the interactive exchange of information.

Additional notes of the Eurasian Economic Union

Machine translation. The original is the Russian text of the EAEU tariff, and customs goes by it; this translation is for understanding only and has no legal force.

1. For the purposes of subheading 8542 31 100 1, the term “process not exceeding 32 nanometers” means a process for the manufacture of electronic integrated circuits in accordance with the technological standards of which the gates of the logical transistors of a microprocessor do not exceed 32 nanometers. Logical transistors are the main computational elements of a microprocessor that implement all arithmetic and logical operations. The gate is the control element of the transistor. Data on the technological process of manufacturing microprocessors are given in the manufacturer's technical documentation, which may be submitted by its authorized representative in the member states of the Eurasian Economic Union.

2. For the purposes of subheading 8535 90 000 1, the term “passage insulators” means devices attached to the flanges of the compartments of modules forming part of a complete switchgear of an elegasic unit (CSG) and intended to separate gas volumes between these compartments or to combine the various CSG modules into a single gas volume, as well as connections through the electrodes of conductors of the CSGM modules built into the passage insulators among themselves during the assembly of the CSGM. Passage insulators are gas dense and non-gas dense. With the help of gas-dense insulators, the gas volumes of KREE are separated. With the help of non-gas-dense insulators, various CSRE modules are combined into one gas volume. Passage insulators consist of a flange ring, a cast insulator and electrodes poured into the insulator.